| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform dicing cut in the state where an adhesive film is stuck on a semiconductor wafer, and to load them on a package together with a sensor chip, while showing a thermal stress mitigation function of the adhesive film, concerning a semiconductor dynamic quantity sensor device formed by loading the sensor chip comprising a semiconductor on the package through the adhesive film. <P>SOLUTION: The adhesive film 40 comprising the first layer 41 and the second layer 42, wherein the first layer 41 has lower elasticity than the second layer 42 and the second layer 42 has a lower water absorbing capacity than the first layer 41, is stuck on the semiconductor wafer 200 so that the first layer 41 and the second layer 42 are placed in this order from the semiconductor wafer 200 side. Then, the semiconductor wafer 200 is dicing-cut together with the adhesive film 40, and thereafter the sensor chip on which the adhesive film 40 is stuck is loaded on the package and stuck with the second layer 42. <P>COPYRIGHT: (C)2007,JPO&INPIT |
