| 摘要 |
A solder ball attach apparatus with an enhanced solder ball holding function and a controlling method thereof are provided to perform quickly effectively a solder ball attach process on a substrate or a wafer by separating selectively abnormal solder balls alone using a solder ball separating unit. A solder ball attach apparatus includes a solder ball storing unit(120) for storing a plurality of solder balls, a solder ball cartridge transfer unit, and a solder ball separating unit. The solder ball cartridge transfer unit(110) is used for transferring a solder ball cartridge with a plurality of solder ball loading holes to an aiming position corresponding to patterns of a substrate. The solder ball cartridge transfer unit includes a suction pipe. The suction pipe supplies a first suction to the solder ball loading holes, so that the solder balls are partially inserted into the solder ball loading holes. The solder ball separating unit(130) supplies a second suction to the solder ball loading holes in order to separate abnormal solder balls alone from the solder ball loading holes.
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