发明名称 Semiconductor device and manufacturing method of semiconductor device
摘要 Dummy gate patterns 111, 112 are formed on a silicon active layer 103 of an SOI substrate, and thereafter, these dummy gate patterns 111, 112 are removed to form gate grooves 130, 132. A threshold voltage of each transistor is adjusted by etching a silicon active layer 103 in any one of these gate grooves 130, 132 to reduce a thickness of a portion constituting a channel region. This enables the enhancement of freedom degree and so on in circuit designing according to conditions.
申请公布号 US2007148937(A1) 申请公布日期 2007.06.28
申请号 US20070709270 申请日期 2007.02.22
申请人 发明人 YAGISHITA ATSUSHI;SAITO TOMOHIRO
分类号 H01L21/00;H01L21/3205 主分类号 H01L21/00
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