| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a solder joint between a land terminal and a solder ball located immediately under an external edge corner of a semiconductor device from getting damaged by stress occurring by difference in thermal expansion, in the semiconductor device having the land terminal connected with a printed wiring board via the solder ball. <P>SOLUTION: A semiconductor element 2 is mounted on one of surfaces of an interposer wiring board 3, and a plurality of lands 9 and 23 are provided on the other surface. The respective lands 9 and 23 consist of land terminals 10 and 24 formed on the board 3, and solder balls 11 and 25 formed on the land terminals 10 and 24. The size of the first land 23 located immediately under the external edge corner B of the element 2 is larger than that of the other land 9. <P>COPYRIGHT: (C)2007,JPO&INPIT |
