发明名称 |
Quad flat non-leaded package semiconductor component, has expansion joint arranged in plastic housing and provided between border angle region and outer contact surfaces of outer contact and central region of housing |
摘要 |
Component has a plastic housing (7) and outer contacts (8), which are embedded in the housing. The contacts are accessible on a lower side of the housing, and are arranged in the lower border angle region. An expansion joint (14) is arranged in the lower side of the plastic housing. The joint is provided between the border angle region and the outer contact surfaces (11) of the outer contact and a central region (12) of the housing. A semiconductor chip is arranged in the central region. An independent claim is also included for: a method for manufacturing a semiconductor component. |
申请公布号 |
DE102006015241(A1) |
申请公布日期 |
2007.06.28 |
申请号 |
DE20061015241 |
申请日期 |
2006.03.30 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
KILLER, THOMAS;SYRI, ERICH;GRUENDLER, GEROLD;HOEGERL, JUERGEN;STRUTZ, VOLKER |
分类号 |
H01L23/50;H01L21/60 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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