| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board wherein connection terminals at micro pitch can be prevented from being short-circuited due to solder and the peeling strength is improved. SOLUTION: Three solder plating layers 15 are formed like a stripe on the surface of each of connection conductor patterns 12A along the extending direction of the connection conductor patterns 12A. The solder plating layer 15 is partly formed on the connection conductor pattern 12A, so that solder can be minimized for solder joint as necessary, and shortcircuiting among the connection terminals due to excessive solder can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
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