| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic part sealing board to realize constitution of an electronic device, in which electromagnetic coupling between an electric connection path and a micro electromechanical system is achieved, and effects of high frequency are restricted. <P>SOLUTION: The electronic part sealing board 4 is for gas-tightly sealing a micro electromechanical system 3 of an electronic part 2 comprising a semiconductor substrate 5, the micro electromechanical system 3 formed on a main surface of the semiconductor substrate 5, and an electrode 6 electrically connected to the micro electromechanical system 3. It is also provided with an insulating board 7 provided with a first major surface to be jointed to the main surface of the semiconductor substrate 5 to gas-tightly seal the micro electromechanical system 3, and a wiring conductor 8, of which one end is introduced to the first major surface of the insulating board 7, with another end electrically connected to the electrode 6 of the electronic part 2. One end of the wiring conductor 8 is positioned outside of a jointed part of the main surface of the semiconductor substrate 5 with the first major surface of the insulating board 7. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
