| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for manufacturing an easy-to-manufacture droplet discharge head which can be miniaturized while attaining high resolution by achieving formation of nozzles at high density and fine pitch wiring incident thereto, and to provide a droplet discharge head manufactured through this process, and a droplet discharge device equipped with that droplet ejection head. SOLUTION: An opening 72A becoming an interconnection path 50 and a trench 72B becoming a pressure chamber 115 are formed in a silicon substrate 72, and the opening 72A and the trench 72B are filled with glass paste 76. Curing heat treatment of the glass paste 76 is then carried out at a temperature higher than the film deposition temperature of an oscillation plate 48 and a piezoelectric element 46 to form the oscillation plate 48 and the piezoelectric element 46 on the silicon substrate 72. Subsequently, the glass paste 76 is removed by etching using solution or gas containing hydrogen fluoride thus manufacturing a droplet discharge head 32. The droplet discharge head 32 is manufactured through this manufacturing process, and a droplet discharge device 10 is equipped with that droplet discharge head 32. COPYRIGHT: (C)2007,JPO&INPIT
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