COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD
摘要
<p>Disclosed is a composition for removing residues from wiring boards, which contains an oxidizing agent and an azole compound while having a pH of 1-7. Also disclosed is a method for cleaning a wiring board wherein residues are removed from a wiring board after dry etching by using such a composition. By using such a composition for removing residues, residues remaining after dry etching which are derived from the resist or metals can be effectively removed without corroding highly corrosion-prone titanium or titanium alloys during production of a wiring board. Consequently, a semiconductor device using a wiring board particularly containing titanium or a titanium alloy can be produced efficiently.</p>
申请公布号
WO2007072727(A1)
申请公布日期
2007.06.28
申请号
WO2006JP324928
申请日期
2006.12.14
申请人
MITSUBISHI GAS CHEMICAL COMPANY, INC.;KUWABARA, EIKO;KASHIWAGI, HIDEO;MATSUNAGA, HIROSHI;OHTO, MASARU