METHOD OF MANUFACTURING AT LEAST ONE SPUTTER-COATED SUBSTRATE AND SPUTTER SOURCE

摘要

Sputtering is performed by making use of a stationary magnetic field (H<SUB>s</SUB>). Uneroded areas of the sputtering surface (3) which are subject to re-deposition are minimized or omitted by modulating the stationary magnetic field (H<SUB>s</SUB>) adjacent to one of the magnetic poles responsible for the stationary magnetic field, by superimposing a modulating magnetic field (H<SUB>m</SUB>) to said stationary field (H<SUB>s</SUB>).