发明名称 |
ABRASIVE PAD |
摘要 |
<p>A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably 70.0-78.0, compressibility of 4% or less or preferably 2% or less, and compression recovery rate of 50% or greater or preferably 70% or greater.</p> |
申请公布号 |
EP1800800(A1) |
申请公布日期 |
2007.06.27 |
申请号 |
EP20050765668 |
申请日期 |
2005.07.13 |
申请人 |
NIHON MICROCOATING CO., LTD. |
发明人 |
IZUMI, TOSHIHIRO;TAMURA, JUN;NAGAMINE, TAKUYA;ARAHATA, TAKASHI |
分类号 |
B24B37/20;B24D13/14;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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