| 摘要 |
A drilling device (24) for drilling contact holes (22) for assembling the contact surfaces (16) of at least one first layer (4) of a multilayer circuit board (2) provided with the contact surfaces (18) of at least one second layer (6) of the multilayer circuit board (2) comprises drilling means for drilling the contact holes (22) and control means for generating control signals for controlling said drilling means according to the drillable contact holes, respectively. The invention is characterised in that the drilling device (24) is provided with integrated means for determining a position displacement between the first (4) and second (6) layers of the multilayer circuit board (2) which are connected to the control means (28) and transmit a signal of the displacement of a determined position thereto, the control means (28) generates the control signals according to the determined position displacement in such a way that the drilling means drills the contact holes (22) according to said determined position displacement. The inventive drilling means comprises at least one laser (26) for producing said contact holes (22). |
