发明名称 |
POLISHING BODY, POLISHER, METHOD FOR ADJUSTING POLISHER, METHOD FOR MEASURING THICKNESS OF POLISHED FILM OR END POINT OF POLISHING, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE |
摘要 |
<p>After a hole is formed in the polishing pad 21, a transparent window plate 31 is inserted into this hole. Here, a gap a is left between the upper surface of the transparent window plate 31 and the outermost surface constituting the working surface of the polishing pad 21. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad 21 and transparent window plate 31 are compressed. In this case, Äthe system isÜ arranged so that the gap a remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate 31 is recessed from the upper surface of the polishing pad 21, there is no scratching of the surface of the transparent window plate 31 during dressing. Accordingly, the polishing pad has a long useful life. <IMAGE></p> |
申请公布号 |
EP1176630(B1) |
申请公布日期 |
2007.06.27 |
申请号 |
EP20000908067 |
申请日期 |
2000.03.14 |
申请人 |
NIKON CORPORATION |
发明人 |
ISHIKAWA, AKIRA;SENGA, TATSUYA;MIYAJI, AKIRA;USHIO, YOSHIJIRO |
分类号 |
H01L21/304;B24B37/013;B24B37/20;B24B49/04;B24B49/12;B24D7/12 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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