发明名称 |
MULTILAYER PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF |
摘要 |
A multilayer printed circuit board and a method for manufacturing the same are provided to have high resistance to an external impact by enclosing a circuit pattern with an insulation layer and to improve the yield and shorten a manufacturing time by integrally laminating laminated plates through thermal compression. A multilayer printed circuit board includes a first laminated plate, a second laminated plate. The first laminated plate has a first insulating layer(130), a first circuit pattern(115), a first via-hole(150), and a conductive material. The first circuit pattern(115) is laid on the first insulating layer(130). A lower part of the first circuit pattern(115) is exposed. The first via-hole(150) is formed on an upper part of the first circuit pattern(115) and penetrates the first insulating layer(130). The conductive material is filled in the first via-hole(150). A second circuit pattern is laid on a location corresponding to the first circuit pattern of a second insulating layer. An upper part of the second circuit pattern is exposed. A second via-hole is formed on a lower part of the second circuit pattern and penetrates the second insulating layer. A conductive material is filled in the second via hole. The second laminated plate is electrically connected to the first laminated plate when the conductive material filled in the first via-hole corresponds to the conductive material filled in the second via-hole.
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申请公布号 |
KR100734234(B1) |
申请公布日期 |
2007.06.26 |
申请号 |
KR20060048144 |
申请日期 |
2006.05.29 |
申请人 |
KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
PARK, SE HOON;PARK, SEONG DAE;YOO, MYONG JAE;KANG, NAM KEE;LEE, WOO SUNG;PARK, JONG CHUL |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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