发明名称 LIGHT PROJECTING APPARATUS OF LIGHT EMITTING DIODE CHIP MODULE
摘要 A light projection apparatus of a light emitting diode chip module is provided to prevent interference of light emitted from each light emitting diode chip by installing an interference prevention groove. A main body unit(210) is tightly attached to an upper surface of a printed circuit board. A plurality of light emitting diode chips are arranged on the printed circuit board. A receiving groove(230) is formed on a bottom surface of the main body unit so as to receive the respective light emitting diode chips. A lens(220) is formed on an upper surface of the receiving groove to focus light emitted from the light emitting diode chip and to transmit it to an upper surface of the main body unit. An interference prevention groove(240) is formed between the receiving grooves so as to prevent interference of the light from the light emitting diode chip with light from a neighboring light emitting diode chip.
申请公布号 KR100733840(B1) 申请公布日期 2007.06.25
申请号 KR20060032368 申请日期 2006.04.10
申请人 LEDO CO., LTD.;KOREA INSTITUTE OF CONSTRUCTION TECHNOLOGY 发明人 KIM, CHUL YONG;JUNG, JUN HWA;LEE, SUK KI
分类号 H01L33/58;H01L33/60 主分类号 H01L33/58
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