| 摘要 |
A method for forming a pad in a semiconductor device is provided to suppress deterioration of a bonding characteristic at a packaging process by using a polymer remaining in a pad region. A lower layer(10) having a metal wiring(11) is prepared, and a passivation film(15) is formed on the lower layer. The passivation film is selectively etched to form a contact hole exposing a portion of the metal wiring at a pad region. A pad is deposited along a stepped portion on the passivation film. A photosensitive film(21) is formed to bury the contact hole. The pad is etched by using the photosensitive film, except for the pad region, and the photosensitive film is removed.
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