| 摘要 |
A polishing apparatus and a polishing method capable of suppressing an excessive polishing of an outer circumferential edge surface of a surface to be polished of a polished object to be polished due to elastic deformation of a polishing tool and capable of stabilizing a polishing rate, wherein polishing is carried out by inclining a shaft of a polishing tool with an angle alpha toward a direction of advance of the movement of the polishing tool to a direction perpendicular to a holding surface of a rotation table, then inclining the shaft of the polishing tool in a direction reducing elastic deformation of a polishing surface in a region where the polishing surface rides up on an outer circumferential edge of a surface to be polished of a wafer to the direction perpendicular to the holding face. |
