发明名称 PULP MOLD FOR PACKING AN ELECTRONIC APPLIANCE
摘要 A pulp mold for buffering and packing an electronic product is provided to safely protect the electronic product without damage by preventing external force from being directly transmitted to the electronic product by deforming buffer support ribs easily. In the pulp mold(10) for buffering and packing an electronic product(1), a fitting groove unit(11) is concavely formed. A portion of one side of the electronic product is fitted to the fitting groove unit. The fitting groove unit is formed by a plurality of buffer support ribs(12) separated at regular intervals along the lateral side. The outer side of the electronic product fitted to the fitting groove unit is supported by the buffer support ribs with contacting to the buffer support ribs. A bent portion(12a) is integrally formed at the buffer support rib to easily contract and deform the buffer support rib by the external force.
申请公布号 KR20070064813(A) 申请公布日期 2007.06.22
申请号 KR20050125324 申请日期 2005.12.19
申请人 DAEWOO ELECTRONICS CORPORATION 发明人 SHIN, MYOUNG HO
分类号 B65D81/02 主分类号 B65D81/02
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