| 摘要 |
PROBLEM TO BE SOLVED: To provide a chucking device capable of suppressing damage at handling even if a substrate, for example, is thin. SOLUTION: A chucking tool 1 for holding a semiconductor wafer W is detachably supported by a chucking pad 10. The tool 1 comprises a plate body 2, a dimple 3 formed on the plate body 2, a deformable holding layer 5 which covers the dimple 3 to hold the semiconductor wafer W, and an exhaust hole 6 which is provided to the plate body 2 for exhausting the air in the dimple 3 covered with the holding layer 5 with the dimple 3 provided with a plurality of supporting protrusions 4 for the holding layer 5. The pad 10 comprises a pad 11 that overlaps with the rear side of the plate body of the tool 1 and an arm 14 extending from the pad 11. The pad 11 is provided with a counter slot 12 facing the backside of the plate body of the tool 1 and a communication slot 13 that communicates with the exhaust hole 6 of the tool 1. The pad 11 and the arm 14 are provided with a supply/discharge path 15 that communicates with the counter slot 12 of the pad 11, and a discharge path 16 that communicates with the communication slot 13 of the pad 11. COPYRIGHT: (C)2007,JPO&INPIT |
