发明名称 THERMAL STRESS MITIGATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermal stress mitigating device capable of effectively preventing the occurrence of crack or separation due to a thermal stress in two kinds of materials, and capable of obtaining excellent durability and high reliability for a long period of time. SOLUTION: The thermal stress mitigating device 30 is provided for mitigating the thermal stress upon generating the thermal stress between two kinds of materials 2, 3, since two kinds of materials 2, 3 are superposed at least in one part thereof through a thermal stress mitigating metal 1 having one layer of low elastic modulus and heat is entered or generated at least in one material between two kinds of materials 2, 3. The strain generated in the thermal stress mitigating device 30 due to the thermal stress can be mitigated by the elastic deformation of one layer of thermal stress mitigating metal 1, without employing a plurality of intermediate layers whereby the occurrence of crack or separation in two kinds of materials is prevented. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007157971(A) 申请公布日期 2007.06.21
申请号 JP20050350307 申请日期 2005.12.05
申请人 NISSAN MOTOR CO LTD 发明人 MOTOJIMA FUMIHIKO;YAMAGUCHI TAKUO
分类号 H01L23/36;B32B15/04;C04B37/02;F02B39/00;H01L23/12 主分类号 H01L23/36
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