| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicone rubber adhesive composition, wherein wire-bondability after jointing a semiconductor pellet to a member for mounting a semiconductor pellet is not deteriorated, and to provide a semiconductor device using the same. SOLUTION: The silicone rubber adhesive composition comprises (A) a polyorgano siloxane containing 2 or more alkenyl groups bound to two or more silicone atoms in a molecule, the content of the alkenyl group being 30-600 mmol/100 g, (B) a polyorgano hydrogen siloxane containing 3 or more SiH groups per molecule, (C) a platinum type catalyst and (D) an adhesive agent, the cured product of the composition having a complex modulus of 0.9 MPa or more at 23°C and 10 Hz shearing frequency and die-shear hardness of 0.05 MPa or more. The semiconductor device comprises a semiconductor pellet and a member for mounting a semiconductor pellet, which are jointed by a cured product of the above silicone rubber adhesive agent. COPYRIGHT: (C)2007,JPO&INPIT |
