| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly heat-conductive resin composition obtained by dispersing insulating inorganic powders in a resin at a high density while suppressing viscosity increase, and a substrate for wiring using the resin composition. SOLUTION: The highly heat-conductive resin composition is obtained by dispersing the insulating inorganic powders (A), (B) and (C) in the insulating resin (R), wherein the inorganic powders comprise 5-20 mass% ultrafine particle powder (A) with an average particle size of 0.1μm or larger but smaller than 1μm, 5-35 mass% fine particle powder (B) with an average particle size of 1-2μm and a coarse particle powder (C) with an average particle size of 30-60μm in the range of 45-90 mass%. The powders (A), (B) and (C) are compounded so that their total becomes 100 mass%. The substrate for wiring is obtained by bonding a conducting layer on a metal base plate via an insulating layer containing the highly heat-conductive resin composition. COPYRIGHT: (C)2007,JPO&INPIT
|
