发明名称 Formation of linear aperture in plastics-fibre reinforced substrate for conductor plate involves guiding laser beam to flat processing area and then forward to one edge before returning to starting point and then onward to second edge
摘要 <p>The method involves guiding a laser beam first at a distance from an edge of the substrate (1) to a flat processing area of the substrate between two edges of the web (4) of the conductor plate (2) and from there moving the laser beam forwards towards the edge. After forming the linear aperture between the starting point of the processing area and a first edge the laser beam is directed back to the starting point and then moved towards a second edge remote from the first. The laser beam preferably moves from the inner area towards the adjoining edge. A suction current at the back removes the released particles from the aperture area.</p>
申请公布号 DE102005054029(B3) 申请公布日期 2007.06.21
申请号 DE20051054029 申请日期 2005.11.10
申请人 LPKF LASER & ELECTRONICS AG 发明人 BAECKER, DIRK;KRIEG, CHRISTIAN;RODDEWIG, EDGAR
分类号 H05K3/00;B23K26/38 主分类号 H05K3/00
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