| 摘要 |
A substrate cleaning method including rotating a substrate at least for a period, supplying a liquid to the front surface of the substrate and cleaning the substrate, and drying the substrate is provided. Said drying of the substrate includes: reducing a rotational speed of the substrate to a first rotational speed lower than a rotational speed for cleaning the substrate; starting to move a liquid supply position from approximately the center of the substrate towards a peripheral portion when the rotational speed of the substrate is reduced down to the first rotational speed; stopping liquid supply when the second rotational speed lower than the first rotational speed is reached; increasing the rotational speed from the second rotational speed; and supplying a gas towards the substrate while rotating the substrate at a higher rotational speed than the second rotational speed.
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