| 摘要 |
A method of dividing a wafer having devices which are composed of a laminate formed on the front surface of a substrate, along a plurality of streets for sectioning the devices, comprising: a laminate dividing step for dividing the laminate formed at the streets of the wafer along the streets; a deteriorated layer forming step for forming a deteriorated layer in the inside of the substrate along the streets by applying a laser beam of a wavelength having permeability for the substrate of the wafer to the rear surface of the wafer along the streets; and a dividing step for dividing the wafer along the streets by exerting external force to the wafer where the deteriorated layers have been formed.
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