发明名称 |
LAMINATED ELECTRONIC CIRCUIT STRUCTURE AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated electronic circuit structure which forms passive components in separate sheet-shaped substrates, respectively arranges the sheet-shaped substrates in clearance regions between connectors and respective circuit boards, constitutes a filter circuit by fitting the connectors and can carry out a lowering of back and a high density mounting, and a method of manufacturing the laminated electronic circuit structure. <P>SOLUTION: A first sheet-shaped substrate 15 is arranged in a region portion surrounded by a first terminal of a male connector 25 and a first circuit substrate 10. A second sheet-shaped substrate 35 is arranged in a region portion surrounded by a second terminal of a female connector 45 and a second circuit substrate 30. By fitting the male connector 25 with the female connector 45, a filter circuit is constituted by a first passive element of the first sheet-shaped substrate 15 and a second passive element of the second sheet-shaped substrate 35. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007158207(A) |
申请公布日期 |
2007.06.21 |
申请号 |
JP20050354401 |
申请日期 |
2005.12.08 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YAMAMOTO KENICHI;SUETSUGU DAISUKE;IMANAKA TAKASHI;HISAMURA HIROTAKA |
分类号 |
H05K1/14;H01R13/719;H01R13/7195;H03H7/06;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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