| 摘要 |
<P>PROBLEM TO BE SOLVED: To monitor the temperature of an element mounted on an optical sub-assembly having a coaxial package by using a relatively inexpensive chip type thermistor. <P>SOLUTION: The optical sub-assembly includes a coaxial package and a FPC (flexible print circuit) board for electrical connection between the sub-assembly and an external circuit board. One electrode of the thermistor is soldered to a line formed on an opposite face of the FPC board to the face opposing to the stem of the sub-assembly, and the other electrode is soldered to a via hole penetrating two faces of the FPC board, wherein the via hole is directly soldered to the stem of the sub-assembly. <P>COPYRIGHT: (C)2007,JPO&INPIT |
