SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND LEAD FRAME THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a means for loading a large-sized semiconductor chip while maintaining size of the semiconductor device loading multiple semiconductor chips to the size less than the specified one. SOLUTION: The semiconductor device 1 comprises a first semiconductor chip 7 including a first plane formed of a first region 7b where a first pad 7a is formed and a second region surrounding the first region; multiple connecting terminals 4 having a front end provided with a second plane 4b arranged on the second region of the first semiconductor chip, a third plane 4a provided opposed to the second plane, and a fourth plane 6a provided opposed to the second plane and is lower by one step than the third plane; and a second semiconductor chip 10 mounted on the third plane of multiple connecting terminals to include a fifth plane where a second pad 10a is formed. COPYRIGHT: (C)2007,JPO&INPIT