| 摘要 |
To facilitate batch production of vacuum-type circuit-interrupting devices, the envelope of such a device has an insert formed with one or more holes for gas extraction during vacuum bake-out and for sealing on completion of bake-out by means of a solder, and possibly also a blanking member, previously placed in the insert. A gold-indium alloy solder is suitable where the bake-out temperature is limited to about 500 DEG C.
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