| 发明名称 |
Manufacturing method of a semiconductor device |
| 摘要 |
<p>A manufacturing method for a semiconductor device comprising the steps of sealing said semiconductor device by bonding a sealing member (13) to a substrate (12) on which a semiconductor element (11) is mounted, and forming a temporary opening (25) in the sealing member (13) so that damages induced by the increase of pressure during heating are suppressed.
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| 申请公布号 |
EP1498959(A3) |
申请公布日期 |
2007.06.20 |
| 申请号 |
EP20040253509 |
申请日期 |
2004.06.11 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SHIRAISHI, SATOSHI;KAZAMA, YOICHI |
| 分类号 |
H01L27/14;H01L31/0203;G03B17/02;G03B19/02;H01L21/00;H01L21/50;H01L21/56;H01L23/00;H01L23/02;H01L27/146;H01L31/00;H01L31/02;H01L31/0232;H04N5/225;H04N5/335 |
主分类号 |
H01L27/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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