发明名称 Single crystal substrate and cutting method thereof
摘要 A single crystal substrate and a cutting method thereof are provided. The single crystal substrate includes a langasite substrate with a SAW propagation surface; and input and output IDTs having electrodes on the surface for launching and/or detecting surface acoustic waves, wherein a direction of surface wave propagation is parallel to an X'-axis, and the substrate farther has an Z'-axis perpendicular to the surface and a Y'-axis parallel to the surface and perpendicular to the X'-axis, the langasite substrate having a crystal orientation defined by modified axes X, Y and Z, the relative orientation of axes X', Y' and Z' being defined by Euler angles phi, theta and psi, in which phi is in a range of 8°<=phi<=25°, theta in a range of 15°<=theta<=30°, and psi is in a range of 55°<=psi<=85°.
申请公布号 US7233095(B2) 申请公布日期 2007.06.19
申请号 US20040517067 申请日期 2004.12.03
申请人 LG INNOTEK CO., LTD. 发明人 CHEREDNICK VALENTIN;DVOESHERSTOV MICHAIL;CHOI YONG LIM
分类号 H01L41/08;H03H9/25;H03H9/02 主分类号 H01L41/08
代理机构 代理人
主权项
地址