| 摘要 |
A method for manufacturing a wiring board is provided to prevent an electrical short circuit of a wiring pattern by etching an exposure part of an insulation layer through anisotropic dry etching. A method for manufacturing a wiring board includes the steps of: forming a plating seed layer on a surface of a catalyst-treated insulation layer by electroless plating; forming a resist pattern on a surface of the plating seed layer; forming a wiring pattern by electrolytic plating so that the resist pattern is formed as a mask and the plating seed layer is formed as a feeding layer; after removing the resist pattern, removing a part to which the plating seed layer is exposed, and performing the electroless plating on an outer surface plane of the wiring pattern; after removing the exposed part of the plating seed layer, etching a part where the insulation layer is exposed by anisotropic dry etching; and performing plating on an outer surface of the wiring pattern by the electroless plating.
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