EXPOSURE APPARATUS CAPABLE OF WAFER RE-ALIGNMENT AND WAFER RE-ALIGNING METHOD THEREBY

摘要

An exposure apparatus capable of re-aligning a wafer and a wafer re-aligning method thereof using the same are provided to re-align a wafer which is not subjected to an exposure process when an abnormal condition happens at a wafer loader. A pre-alignment unit(220) pre-aligns a wafer loaded by a robot(210). The wafer is exposed by light in a wafer stage(240). The wafer is transferred to the wafer stage by a load slider(231), and the wafer exposed by the light is transferred by an unload slider(235). A developing spinner develops the wafer exposed by the light. A buffer receptacle(270) receives a wafer rejected when an abnormal condition happens at the loading of the wafer onto the wafer stage. A wafer discerning unit(260) discerns the rejected wafers which are received in the buffer receptacle to transfer the wafers to the pre-alignment unit.