| 摘要 |
Provided is an adhesive composition for a coverlay film which is improved in flexibility, heat resistance and storage stability and enhances the adhesive strength, chemical resistance and flexibility of a coverlay film. The adhesive composition comprises 100 parts by weight of an acrylic copolymer resin which comprises 1-20 wt% of an acrylic copolymer having a weight average molecular weight of 500-500,000 and 80-99 wt% of an acrylic copolymer having a weight average molecular weight of 1,500,000-3,500,000; 5-50 parts by weight of an epoxy resin having at least two epoxy groups; 0.05-5 parts by weight of a low temperature curing agent and 0.05-5 parts by weight of a high temperature curing agent; 5-50 parts by weight of a flame retardant compound; and 1-30 parts by weight of an inorganic filler, wherein the low temperature curing agent is at least one isocyanate compound selected from trilene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylene diisocyanate, hydrogenated xylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tetramethylxylene diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, and polymethylene polyphenyl isocyanate. |
