A current interrupt mechanism for electrochemical cells is disclosed. A thermally activated current interrupt mechanism is integrated into an end cap assembly for an electrochemical cell. The thermally responsive mechanism preferably includes a free floating bimetallic disk or shape memory alloy member which deforms when exposed to elevated temperature causing a break in an electrical pathway within the end cap assembly. This prevents current from flowing through the cell and effectively shuts down an operating cell. The thermally responsive mechanism may include a heat producing electrical resistance means, preferably a Zener diode, to enhance thermal sensitivity. The end cap assembly may include a pressure responsive mechanism which ruptures when there is extreme gas pressure buildup. Gas is allowed to escape from the cell interior to the external environment through a series of vent apertures within the end cap assembly.
