发明名称 |
VERBESSERUNGEN IN BEZUG AUF INTEGRIERTE SCHALTUNGEN |
摘要 |
A thick plated interconnect (80) comprising a copper lead (50) and a bonding cap (84) coupled to the copper lead (50). The bonding cap (84) may include a bondable member (86) formed from a bondable layer (62) comprising aluminum. A barrier member (88) may be formed from a barrier layer (60). The barrier member (88) may be disposed between the bondable member (86) and the copper lead (50). <IMAGE> |
申请公布号 |
AT363732(T) |
申请公布日期 |
2007.06.15 |
申请号 |
AT19970310336T |
申请日期 |
1997.12.19 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
EFLAND, TAYLOR R.;MAI, QUANG X.;WILLIAMS, CHARLES E.;KELLER, STEPHEN A. |
分类号 |
H01L21/28;H01L23/532;H01L21/3205;H01L23/485;H01L23/52 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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