| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus with a simple structure, capable of etching the whole surface of the lower surface of a semiconductor wafer. SOLUTION: The semiconductor manufacturing apparatus includes a rotating means for rotating the semiconductor wafer 1, while performing support by a part of the lower surface; and plasma generating means 30, 32 for generating plasma for etching in the upper part of the rotating semiconductor wafer 1. When etching species generated in the plasma goes to the lower surface of the semiconductor wafer 1, the lower surface of the semiconductor wafer 1 is etched. The rotating means includes a first belt member 10 for supporting the lower surface of the semiconductor wafer 1 by a part other than the center of the lower surface; a second belt member 12 which is arranged at the opposite position of the first belt member 10 by holding the center of the lower surface of the semiconductor wafer 1, and is disposed substantially in parallel with the first belt member 10; and belt driving means 20, 22 for moving the first belt member 10 in a first direction, and moving the second belt 12 in the opposite direction of the first direction. COPYRIGHT: (C)2007,JPO&INPIT
|
