Verfahren zur Herstellung von Kontaktstrukturen

摘要

Contact structure production comprises two-dimensional photolithography on a silicon substrate. Contact structure production process comprises: (a) successively forming an auxiliary layer, a conductive layer and a photolacquer layer on a silicon substrate surface; (b) exposing the photolacquer layer with UV light through a photomask having a contact structure pattern; (c) developing the photolacquer layer to form openings; (d) depositing conductive material in the openings; (e) removing the photolacquer layer; (f) removing the auxiliary layer by etching to separate the contact structures from the substrate; and (g) etching the conductive layer from the contact structures. An Independent claim is also included for production of a contact mechanism with contact structures, comprising the above process.