| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor element capable of readily bonding between the sensor element and through-hole wiring substrate. SOLUTION: The sensor element has the sensor substrate 1, the through-hole wiring substrate 2 attached on the surface side of the substrate 1, and a cover substrate 3 attached on the other side of the sensor substrate 1. The sensor substrate 1 and the through-hole wiring substrate 2 are connected with a first connecting metal layer 18 and a second connecting metal layer 28 for shielding formed on each facing surface, and also the first connecting metal layer 19 and the second connecting metal layer 29 formed on each facing surface are connected. The sensor substrate 1 is formed with a first alloy layer 19 for connection to the metal wiring 17 is formed in the recess 21 for displacement space, formed in a surface facing the sensor substrate 1 in the through-hole wiring substrate 2. COPYRIGHT: (C)2007,JPO&INPIT
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