PRINTED WIRING BOARD WITH COMPONENT-MOUNTING PINS AND ELECTRONIC EQUIPMENT USING THE SAME

摘要

A printed wiring board and electronic equipment using the same are provided to reduce the occurrence of connecting defects caused by thermal expansion coefficients between a semiconductor chip and the print wiring board even though a highly integrated semiconductor is mounted on the printed wiring board. Electronic equipment (4) comprises a printed wiring board (1) with a component-mounting pin (19), and a plate-mounting type semiconductor device (2) with an electrode pad (3), wherein a component mounting pin (18) has elasticity to contact the electrode pad (3) with pressure so that an electrical connection is formed between the component mounting pin (18) and the electrode pad (3).