发明名称 FIBER-REINFORCED COMPOSITE RESIN COMPOSITION, ADHESIVE AND SEALANT
摘要 PROBLEM TO BE SOLVED: To provide a fiber-reinforced composite resin composition used as a sealant, adhesive or filling agent, having high transparency, further sufficiently satisfying a low thermal expansion property, high strength, light-weighted property, high thermal conductivity of such the levels that have been required in recent years, especially isotropic high heat conductivity. SOLUTION: This fiber-reinforced composite resin composition used as a sealant, adhesive or filling agent and containing the fibers and a liquid state precursor of a matrix resin is characterized in that the fibers have 4-200 nm mean fiber diameter, the total light transmittance at 400-700 wave length based on 50μm thickness of the cured material obtained by curing the composition as a plate form is≥70% and both of the heat conductivity in the thickness-wise direction and plate surface-wise direction of the cured material is≥0.4 W/m×K, and the fibers are oriented randomly in the composition. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007146143(A) 申请公布日期 2007.06.14
申请号 JP20060290598 申请日期 2006.10.26
申请人 KYOTO UNIV;ROHM CO LTD;MITSUBISHI CHEMICALS CORP;HITACHI LTD;PIONEER ELECTRONIC CORP;NIPPON TELEGR & TELEPH CORP <NTT> 发明人 YANO HIROYUKI;ATAGI MASAYA;IFUKU SHINSUKE;ABE KENTARO;TAKEZAWA YOSHITAKA;HANDA KEISHIN
分类号 C08L101/00;C08J5/00;C08K7/02;C09J11/08;C09J201/00;C09K3/10 主分类号 C08L101/00
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