发明名称 |
RESIN EMULSION FOR SOLDERING FLUX, METHOD FOR MANUFACTURING THE SAME, AND SOLDERING FLUX |
摘要 |
PROBLEM TO BE SOLVED: To provide a soldering flux with which the content of a non-VOC (volatile compound) as a countermeasure against VOC can be reduced by using a conventional base resin and which is excellent in drying property, uniform thin film formability, insulation resistance, etc. SOLUTION: The resin emulsion obtained by causing emulsification dispersion of an organic solvent solution of a resin for the soldering flux by using an emulsification equipment equipped with an ultrasonic oscillator is characterized by using an organic solvent of≥200°C in boiling point as the organic solvent. The method for manufacturing the resin emulsion for the soldering flux is characterized by continuously supplying the organic solvent solution of the resin for the soldering flux and the aqueous emulsifier solution from different flow passages to the emulsification equipment to continuously obtain the resin emulsion. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007144446(A) |
申请公布日期 |
2007.06.14 |
申请号 |
JP20050340530 |
申请日期 |
2005.11.25 |
申请人 |
ARAKAWA CHEM IND CO LTD |
发明人 |
UEDA JUNPEI;TANAKA TAKASHI |
分类号 |
B23K35/363;B23K35/26;B23K35/40;C22C13/00 |
主分类号 |
B23K35/363 |
代理机构 |
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