| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate transporting apparatus capable of transporting a substrate such as a semiconductor wafer with high precision for a long period of time, while reducing a thermal effect from a deposition treatment device to a minimum. SOLUTION: The apparatus is provided with a heat conduction preventer for preventing heat conduction, for example, a cutting grooves 8 or a low-temperature melting substances etc. between the tip of a tip arm 4, 104 connected to a placing member 5 of a wafer W and the base end of the tip arm 4, 104. COPYRIGHT: (C)2007,JPO&INPIT
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