EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ENCAPSULATION

摘要

Disclosed is an epoxy resin composition for optical semiconductor encapsulation which contains an epoxy resin obtained by co-hydrolysis/condensation of alkoxy silicon compounds expressed as XSi(R 1 ) n (OR 2 ) 3-n (wherein X represents an organic group having an epoxy group; R 1 represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted aryl group or a substituted or unsubstituted alkenyl group having 2-5 carbon atoms; R 2 represents an alkyl group having 1-4 carbon atoms; n represents an integer of 0-2; and when more than one R 1 are included, they may be the same as or different from each other) or co-hydrolysis/condensation of such an alkoxy silicon compound and another specific alkoxy silicon compound.