CIRCUIT BOARD ASSEMBLY WITH REDUCED CAPACITIVE COUPLING

摘要

In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and defines a conductor plane. The structure further includes an oversized-in-diameter anti-pad formed through the substrate layer and the conductor layer. The anti-pad further includes a dielectric spacer formed substantially coplanar with the conductor plane.