SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

A semiconductor integrated circuit device is provided to perform a wire bonding process without changing the length of a bonding wire by arranging front ends of plural internal leads in a V-shape. A semiconductor chip(2) has a square plane shape and a cylindrical surface where an integrated circuit and plural bonding pads are formed. A die pad(3) is smaller than the area of the cylindrical surface of the semiconductor chip and has a mounting surface supporting the semiconductor chip. Plural suspension leads(4) have a long shape. An end of each suspension lead is connected to the die pad and the other end thereof is arranged on a position farther from the die pad than the end. Plural leads(5) have a long shape, are arranged around the semiconductor chip, and includes internal leads and external leads. The internal leads are arranged between the suspension leads. The external leads are arranged on a position farther from the die pad than the internal lead. Plural wires electrically connect the bonding pads of the semiconductor chip to the internal lead unit of the leads. A package main frame seals the semiconductor chip, the die pad, the internal lead units, and the wires. Front ends of the internal leads are arranged along each edge of the semiconductor chip in a V-shape.