发明名称 |
HOUSING FOR CAMERA MODULE PACKAGE AND CAMERA MODULE PACKAGE THEREWITH |
摘要 |
A housing for a camera module package and a camera module package including the housing are provided to easily fix a board on which electronic components are mounted to a designated position to improve productivity. A housing(10) for a camera module package includes a main body(11) and a fixing part(12). The main body includes a top opening combined with a lens barrel and a bottom opening combined with a sensor board to which an image sensor is attached. The fixing part is integrated with the main body and includes a plate(13) onto which a board with electronic components mounted thereon is attached, guides(14) vertically projected from the flange of the mount to come into contact with the side of the board with electronic components mounted thereon, and protrusions(15) projected from the guides to the inside of the mount.
|
申请公布号 |
KR20070060703(A) |
申请公布日期 |
2007.06.13 |
申请号 |
KR20050120632 |
申请日期 |
2005.12.09 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HONG, SEOG JIN |
分类号 |
H04N5/225;H04B1/40;H05K7/12 |
主分类号 |
H04N5/225 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|