| 摘要 |
A dielectric lamination structure, a manufacturing method of the dielectric lamination structure, and a wiring board including the dielectric lamination structure are provided to obtain the flat dielectric lamination structure with sufficient flexibility by laminating a dielectric layer and a conductor layer on a metal film having high hardness. A dielectric lamination structure(1) includes a metal film(2), a dielectric layer(3), a conductor layer(4) arranged sequentially. The metal film(2) has a thickness of 10-40um. The dielectric layer(3) has a thickness of 0.3-5um. The conductor layer(4) has a thickness of 0.3-10um. A plurality of vias is separated from each other and penetrate through both of the dielectric layer(3) and the conductor layer(4). The vias penetrating through the dielectric layer(3) have various sizes of diameters in the range of 100 - 300um. The vias penetrating through the conductive layer(4) have diameters of 5-50um larger than the corresponding vias of the dielectric layer(3) and the minimum via pitch is 100 - 350um. |
