发明名称 |
Copper ring solder mask defined ball grid array pad |
摘要 |
A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.
|
申请公布号 |
US7230339(B2) |
申请公布日期 |
2007.06.12 |
申请号 |
US20030402101 |
申请日期 |
2003.03.28 |
申请人 |
INTEL CORPORATION |
发明人 |
KEY CHUNG C.;FOO LEONG KUM;TIEN PANGTOH |
分类号 |
H01L23/48;H01L23/498;H01L23/52;H01L29/40;H05K1/11;H05K3/34 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|