| 摘要 |
A printed circuit board and a manufacturing method thereof are provided to accurately mount parts on the printed circuit board by accurately performing a temporary assembly and the soldering. A printed circuit board includes a substrate(21), an insulation layer, a circuit pattern, through holes(23), lands(23'), terminals(24), and oval through holes(25). The substrate(21) is formed in a plate type. The insulation layer is formed inside the substrate(21). The circuit pattern is formed on a surface of the insulation layer. The through holes(23) are punched on the substrate(21). The lands(23') are formed on edges of the through holes(23). The land(23') is a kind of circuit pattern and is exposed to a surface of the substrate(21). The oval through holes(25) are formed for mounting the terminals(24). The through hole(25) consists of a supporting through hole unit(26) and a soldering through hole unit(27). Both ends of the oval through hole(25) are the supporting through hole units(26). The soldering through hole unit(27) is formed in the center of the oval through hole(25) to connect the supporting through hole units(26).
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